Synthesis and thermal curing of aryl-ethynyl-terminated coPOSS imide oligomers:: New inorganic/organic hybrid resins

A new bis(amino)-functionalized POSS monomer was prepared and characterized with the formula diexo-(c-C5H9)(8)Si8O11(p-C6H4NH2)(2). The new POSS monomer (1-10 cool %) along with diamines 1,3-bis(3-aminophenoxy)benzene (APB) and 3,4'-oxydianiline (ODA) and were copolymerized with 4,4'-oxydiphthalic anhydride (ODPA) and two reactive end-caps, 4-(aryl-ethynyl)phthalic anhydride {where aryl = phenyl and 9-anthracenyl } to afford a series of new inorganic/organic imide oligomers. The oligomers containing 1% and 10% POSS gave similar T-g data (approximate to191 and 203 degreesC) as the pure organic imide oligomers and were shown to thermally cure to afford solvent-resistant and high T-g resins. The thermal curing kinetic data for the 10%-POSS-containing imide was obtained. The kinetic data showed the rate of thermal curing to be unaffected (within experimental deviation) by the addition of the POSS units.