4.6 Article

A capacitive fingerprint sensor chip using low-temperature poly-Si TFTs on a glass substrate and a novel and unique sensing method

期刊

IEEE JOURNAL OF SOLID-STATE CIRCUITS
卷 38, 期 2, 页码 274-280

出版社

IEEE-INST ELECTRICAL ELECTRONICS ENGINEERS INC
DOI: 10.1109/JSSC.2002.807172

关键词

biometrics; capacitive sensor; fingerprint sensor; glass substrate; low-temperature poly-Si

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We have developed a capacitive fingerprint sensor chip using low-temperature poly-Si thin film transistors (TFTs). We have obtained good fingerprint images which have sufficient contrast for fingerprint certification. The sensor chip comprises sensor circuits, drive circuits, and a signal processing circuit. The new sensor cell employs only one transistor and one sensor plate within one cell. There is no leakage current to other cells by using a new and unique sensing method. The output of this sensor chip is an analog wave and the designed maximum output level is almost equal to the TFT's threshold voltage, which is 2-3 V for low-temperature poly-Si TFTs. We used glassed substrate and only two metal layers to lower the cost. The size of the trial chip is 30 mm x 20 mm x 1.2 mm and the sensor area is 19.2 mm x 15 mm. The size of the prototype cell is now 60 pm x 60 mum at 423 dpi, but it will be easy to increase the resolution up to more than 500 dpi. The drive frequency is now 500 kHz and the power consumption is 1.2 mW with a 5-V supply voltage. This new fingerprint sensor is most suitable for mobile use because the sensor chip is low cost and in a thin package with low power consumption: Index Terms-Biometrics, capacitive sensor, fingerprint sensor, glass substrate, low-temperature poly-Si.

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