期刊
IEEE TRANSACTIONS ON COMPONENTS AND PACKAGING TECHNOLOGIES
卷 26, 期 1, 页码 16-25出版社
IEEE-INST ELECTRICAL ELECTRONICS ENGINEERS INC
DOI: 10.1109/TCAPT.2003.811463
关键词
heat sinks; least-energy; least-material; optimization; plate-fin; sustainable development
The, development, of heat, sinks for, microelectronic applications, which are compatible with sustainable development, involves the achievement of a subtle balance between a superior thermal design, minimum material consumption, and minimum pumping power. This presentation explores the potential for the least-energy optimization of natural and forced convection,cooled rectangular plate heat sinks. The results are evaluated in terms of a heat sink Coefficient of Performance, relating the cooling rapability to the energy invested in the fabrication and operation of the heat sink, and compared to the entropy generation minimization methodology (EGM).
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