期刊
SEMICONDUCTOR SCIENCE AND TECHNOLOGY
卷 18, 期 3, 页码 S96-S104出版社
IOP PUBLISHING LTD
DOI: 10.1088/0268-1242/18/3/314
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Research and development have been carried out to apply the CVD diamond film to surface acoustic wave (SAW) devices. Several kinds of layered structures including a diamond layer have been investigated by the calculations and experiments, and it has been found that the diamond SAW has great advantages for the application of high-frequency SAW devices with high SAW velocity, small temperature coefficient and high power durability. Practical SAW devices have been successfully fabricated with ZnO/diamond/Si and SiO2/ZnO/diamond/Si structures whose characteristics are superior to those with conventional SAW materials.
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