4.7 Article

The effects of triple junctions and grain boundaries on hardness and Young's modulus in nanostructured Ni-P

期刊

SCRIPTA MATERIALIA
卷 48, 期 6, 页码 825-830

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PERGAMON-ELSEVIER SCIENCE LTD
DOI: 10.1016/S1359-6462(02)00511-0

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interfaces; mechanical properties; nanoindentation; nanocrystalline materials; electroplating

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Hardness and Young's modulus were measured on a series of nanocrystalline Ni-P samples. With decreasing grain size, a transition from regular to inverse Hall-Petch relationship and. a reduction in Young's modulus at the smallest grain sizes was observed, which can be attributed to grain boundary and triple junction effect. (C) 2002 Acta Materialia Inc. Published by Elsevier Science Ltd. All rights reserved.

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