期刊
CATALYSIS COMMUNICATIONS
卷 4, 期 4, 页码 183-187出版社
ELSEVIER
DOI: 10.1016/S1566-7367(03)00031-1
关键词
photoelectrochemistry; photocatalysis; Cu deposition; TiO2; formic acid
The application of a small anodic bias can promote the photocatalytic oxidation of formic acid on Cu-TiO2 film. However, the photocatalytic activity was not stable at higher anodic biases or in the process of repeated use due to the electrochemical oxidation of Cu. A new photocatalytic technology with a pulse anodic bias was proposed to tackle the deficiency of the Cu-TiO2 film. It was found that the photocatalytic technology could not only overcome the Cu oxidation but also increased the photocatalytic activity of the Cu-TiO2 film. (C) 2003 Elsevier Science B.V. All rights reserved.
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