期刊
IEEE TRANSACTIONS ON MICROWAVE THEORY AND TECHNIQUES
卷 51, 期 4, 页码 1067-1075出版社
IEEE-INST ELECTRICAL ELECTRONICS ENGINEERS INC
DOI: 10.1109/TMTT.2003.809674
关键词
on-chip solenoid inductor; plastic deformation magnetic assembly (PDMA); three-dimensional (3-D) assembly; vertical spiral inductor
On-chip inductors are critical for enabling portables power-efficient wireless communication systems. Existing on-chip spiral inductors based on conventional planar integrated-circuit fabrication technology suffer from substrate loss and parasitics, and have relatively large footprints. In this paper, we discuss the development of on-chip three-dimensional (3-D) inductors-a vertical spiral inductor and a solenoid inductor-by using a 3-D assembly process called plastic deformation magnetic assembly. Prototype vertical spiral inductors and solenoid inductors have been fabricated and tested. Experimental results show that the vertical spiral inductors can achieve better performance and a smaller footprint than the in-plane ones.
作者
我是这篇论文的作者
点击您的名字以认领此论文并将其添加到您的个人资料中。
推荐
暂无数据