期刊
ACS APPLIED MATERIALS & INTERFACES
卷 7, 期 34, 页码 19251-19259出版社
AMER CHEMICAL SOC
DOI: 10.1021/acsami.5b05147
关键词
copper nanowires; electrodeposition; nanocomposite; thermal interface material; thermal conductivity
资金
- NSF/DOE Partnership on Thermoelectric Devices for Vehicle Applications [1048796]
- Northrop Grumman Aerospace Systems grant
- U.S. Department of Defense
- Air Force Office of Scientific Research
- National Defense Science and Engineering Graduate (NDSEG) [32 CFR 168a]
- National Science Foundation Graduate Research Fellowship Program
- NSF through the National Nanotechnology Infrastructure Network
- Div Of Chem, Bioeng, Env, & Transp Sys
- Directorate For Engineering [1048796] Funding Source: National Science Foundation
The ability to efficiently and reliably transfer heat between sources and sinks is often a bottleneck in the thermal management of modern energy conversion technologies ranging from microelectronics to thermoelectric power generation. These interfaces contribute parasitic thermal resistances that reduce device performance and are subjected to thermomechanical stresses that degrade device lifetime. Dense arrays of vertically aligned metal nanowires (NWs) offer the unique combination of thermal conductance from the constituent metal and mechanical compliance from the high aspect ratio geometry to increase interfacial heat transfer and device reliability. In the present work, we synthesize copper NW arrays directly onto substrates via templated electrodeposition and extend this technique through the use of a sacrificial overplating layer to achieve improved uniformity. Furthermore, we infiltrate the array with an organic phase change material and demonstrate the preservation of thermal properties. We use the 30) method to measure the axial thermal conductivity of freestanding copper NW arrays to be as high as 70 W m(-1) K-1, which is more than an order of magnitude larger than most commercial interface materials and enhanced-conductivity nanocomposites reported in the literature. These arrays are highly anisotropic, and the lateral thermal conductivity is found to be only 1-2 W m(-1) K-1. We use these measured properties to elucidate the governing array-scale transport mechanisms, which include the effects of morphology and energy carrier scattering from size effects and grain boundaries.
作者
我是这篇论文的作者
点击您的名字以认领此论文并将其添加到您的个人资料中。
推荐
暂无数据