期刊
MICROELECTRONIC ENGINEERING
卷 67-8, 期 -, 页码 508-519出版社
ELSEVIER SCIENCE BV
DOI: 10.1016/S0167-9317(03)00108-4
关键词
silicon microphone; silicon MEMS; bonded wafer; etch-stop
We have succeeded in fabricating an ultra-small condenser microphone that has excellent acoustic characteristics, and excellent reliability and mass-producibility, with an integrated structure made from single-crystalline silicon, a material that has high tensile strength. This is owing to the use of a bonded wafer, which is prepared using powder silicon oxide as a glue (SODIC method), and precise control of the thickness of the diaphragm, a thin film that vibrates under acoustic pressure. The microphone's acoustic characteristics are: wide dynamic range with excellent linearity up to 10 Pa, wide frequency range of 75 Hz-24 kHz, and high sensitivity of - 47 dB (0 dB = 1 V/Pa). Since it is made of single-crystalline silicon, it is robust and thermally resistant. Moreover, it has suitability to mass production, because it is fabricated with a semiconductor process. (C) 2003 Elsevier Science B.V. All rights reserved.
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