期刊
MICROELECTRONICS RELIABILITY
卷 43, 期 8, 页码 1259-1266出版社
PERGAMON-ELSEVIER SCIENCE LTD
DOI: 10.1016/S0026-2714(03)00181-1
关键词
-
Current leakage and breakdown of MIM capacitors using HfO2 and Al2O3-HfO2 stacked layers were studied. Conduction in devices based upon HfO2 layers thinner than 8 nm is probably dominated by tunnelling. Al2O3-HfO2 stacked layers provide a limited benefit only in term of breakdown field. Constant-voltage wear-out of samples using insulating layer thicker than 6 nm is dominated by a very fast increase of the leakage current. A two step mechanism involving the generation of a conduction path followed by a destructive thermal effect is proposed to explain breakdown mechanism. (C) 2003 Elsevier Ltd. All rights reserved.
作者
我是这篇论文的作者
点击您的名字以认领此论文并将其添加到您的个人资料中。
推荐
暂无数据