期刊
IEEE TRANSACTIONS ON ADVANCED PACKAGING
卷 26, 期 3, 页码 277-282出版社
IEEE-INST ELECTRICAL ELECTRONICS ENGINEERS INC
DOI: 10.1109/TADVP.2003.817964
关键词
chip-scale package; getter; hermetic electrical lead transfer; MEMS; resonator; vacuum packaging
A new approach to vacuum packaging of micromachined resonant, tunneling, and display devices is covered in this paper. A multi-layer, thin-film getter, called a NanoGetter, which is particle free and does not increase the chip size of the microsystem has been developed And, integrated into conventional wafer-to-wafer bonding processes. Hermetic. electrical feedthroughs are Also provided as part of this total-solution technology. Experimental data taken with silicon resonators is presented in which Q values in excess, of 21,000 have been obtained. Applications for this technology include gyroscopes, accelerometers, displays, flow sensors, density meters', infrared (IR) sensors, microvacuum tubes, radio frequency microelectromechanical systems (RF-MEMS) and pressure sensors.
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