Electrochemical behavior of a new solder material (Sn-In-Ag)

New solder alloys are being developed for electronic assemblies in replacement for traditional Pb-containing solder materials. New low-melting-point, Sn-In-Ag-based alloys have been investigated. Corrosion resistance and the influence of In and Ag content on the electrochemical behaviour have been studied for some Sn-In-Ag special alloys in 3% NaCl solution. The good resistance of this ternary system has been confirmed, and the increase of corrosion resistance with Ag content of Sn-In-Ag alloys has been established. (C) 2003 Elsevier Science B.V. All rights reserved.