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High transconductance enhancement-mode AlGaN/GaN HEMTs on SiC substrate

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ELECTRONICS LETTERS
卷 39, 期 24, 页码 1758-1760

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INST ENGINEERING TECHNOLOGY-IET
DOI: 10.1049/el:20031124

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Using inductively-coupled-plasma reactive ion etching (ICP-RIE), recessed 1 mum gate-length enhancement-mode (E-mode) AlGaN/GaN high electron mobility transistors (HEMTs) were fabricated. These 1 mum gate-length devices exhibited maximum drain current density of 470 mA/mm, extrinsic transconductance of 248 mS/mm and threshold voltage of 75 mV These characteristics are much higher than previously reported values for GaN-based E-mode HEMTs. A unity gain cutoff frequency (f(T)) of 8 GHz and a maximum frequency of oscillation (f(max)) of 26 GHz were also measured on these devices.

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