期刊
JOURNAL OF ELECTRONIC MATERIALS
卷 32, 期 12, 页码 1403-1413出版社
MINERALS METALS MATERIALS SOC
DOI: 10.1007/s11664-003-0108-0
关键词
lead-free solder; Sn-3.5Ag; intermetallics; solder reflow; thermal aging
Intermetallic-layer formation and growth in Pb-free solder joints, during solder reflow or subsequent aging, has a significant effect on the thermal and mechanical behavior of solder joints. In this study, the influence of initial intermetallic morphology on growth rate, and kinetics were examined in a Sn-3.5Ag solder reflowed on Cu. The initial morphology of the intermetallic was tailered by cooling in water, air, or furnace conditions. Solder aging was conducted at 100degreesC, 140degreesC, and 175degreesC and aged for 0-1,000 h. Cooling rate, aging temperature, and aging time played an important role on microstructure evolution and growth kinetics Of Cu6Sn5 (eta) and Cu3Sn (F) intermetallic layers. Prior to aging, faster cooling rates resulted in a relatively planar Cu6Sn5 layer, while a nodular Cu6Sn5 morphology was present for slower cooling. Intermetallic-growth rate measurements after aging at various times, indicated a mixed growth mechanism of grain-boundary and bulk diffusion. These mechanisms are discussed in terms of the initial intermetallic thickness and morphology controlled by cooling rate, diffusion kinetics, and the competition between Cu6Sn5 and Cu3Sn growth.
作者
我是这篇论文的作者
点击您的名字以认领此论文并将其添加到您的个人资料中。
推荐
暂无数据