Electrochemical investigation of dynamic interfacial processes at 1-octadecanethiol-modified copper electrodes in halide-containing solutions

1-Octadecanethiol (C18SH) monolayers were self-assembled on the fresh and active copper surface pretreated by nitric acid etching method. The surface properties of the alkanethiol-modified copper electrode in halide-containing solutions were characterized systematically by using several electrochemical methods, including polarization curves, cyclic voltammetry, electrochemical impedance spectroscopy (EIS) and electrochemical noise (EN). The results show that C18SH self-assembled monolayers (SAMs) onto copper provide a flexible method that can protect the underlying copper against corrosion. With the immersion time of SAMs-coated copper electrode in NaCl and HCl corrosive solutions increasing, a slow loss of corrosion protection ability of SAMs indicates dynamic processes occurring at the electrode/solution interface and in the monolayers, such as expansion of the defects and transport of corrosive ions through defects of SAMs. Electrochemical noise (EN) is employed to detect the alkanethiol-modified copper surfaces immersed in HCl solution. This observation suggests the pitting process associate with dynamic processes in the I-octadecanethiol layer. (C) 2003 Elsevier Ltd. All rights reserved.