期刊
JOURNAL OF MICROSCOPY-OXFORD
卷 213, 期 -, 页码 247-256出版社
BLACKWELL PUBLISHING LTD
DOI: 10.1111/j.0022-2720.2004.01297.x
关键词
alignment; boundaries; connectivity; electron backscatter diffraction; grain-boundary engineering; grains; microstructure; quantitative metallography; subgrains
类别
Electron backscatter diffraction maps are capable of yielding a substantial amount of quantitative information about grains, subgrains and boundaries, and the amount and quality of the data may be substantially increased if the pixels of the map are re-analysed so as to 'reconstruct' complete grains or subgrains. The paper discusses the various methods of grain reconstruction and the use of such methods to obtain microstructural information correlating the parameters of dimension, position, orientation and misorientation, which cannot usually be obtained by other means. Grain reconstruction also reveals the nature, location and contacts of all the triple junctions in the microstructure. and the paper discusses two important examples of how these data may be further analysed using automated routines. Boundary connectivity and the length and direction of likely paths along which grain boundary events such as creep fracture or stress corrosion may occur can readily be determined. The overall alignment of boundaries in deformed metals, with respect to the crystallography and the deformation geometry, may be determined as a function of the length and misorientation of the boundary segments.
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