4.7 Article Proceedings Paper

Study of new fluorine-containing epoxy resin for low dielectric constant

期刊

SURFACE & COATINGS TECHNOLOGY
卷 180, 期 -, 页码 650-654

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ELSEVIER SCIENCE SA
DOI: 10.1016/j.surfcoat.2003.10.111

关键词

fluorine; epoxy resins; cure behavior; activation energy; critical stress intensity factor; dielectric constant

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In this work, the novel fluorine-containing epoxy resin, 2-diglycidylether of benzotrifluoride (DGEBTF), was prepared and the chemical structure of DGEBTF was confirmed by FT-IR, C-13 NMR and F-19 NMR spectroscopy. Also, the properties of DGEBTF/ diaminodiphenyl methane (DDM) and well-known diglycidylether of bisphenol A (DGEBA)/DDM systems were investigated. As a result, the dielectric constant values of DGEBTF/DDM system were 15% lower than those of DGEBA/DDM system. The critical stress intensity factor and impact strength of DGEBTF/DDM and DGEBA/DDM systems were 5.63 MPa m(1/2), 50 kN/ m(2) and 3.53 MPa m(1/2) 26 kN/m(2), respectively. The introduction of trifluoromethyl (CF3) group into the chain of the epoxy resin resulted in improving the dielectric and mechanical properties and enormously lowered the T-g (105 degreesC) of the studied DGEBTF/ DDM. It comes from the internal network change of cured resin. (C) 2003 Elsevier B.V. All rights reserved.

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