期刊
IEEE TRANSACTIONS ON ADVANCED PACKAGING
卷 27, 期 2, 页码 341-351出版社
IEEE-INST ELECTRICAL ELECTRONICS ENGINEERS INC
DOI: 10.1109/TADVP.2004.828822
关键词
antennas; codesign; integration; system-on-package (SOP)
The successful deployment of wireless systems requires the integration of small, cost-effective antennas while preserving a reasonable electrical performance in the required bandwidth. This paper begins with a short overview of the most important antenna characteristics, and then uses these to describe the minimum requirements and fundamental performance-size limits for electrically small integrated antennas. The performance-size tradeoff is further illustrated by the design of a planar integrated antenna for WLAN. Codesign guidelines are given to avoid parasitic coupling between the integrated antenna and RF circuits. A concluding comparison is made between on-chip and on-package integration of a small antenna for microwave and millimeter wave systems.
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