期刊
IEEE TRANSACTIONS ON COMPONENTS AND PACKAGING TECHNOLOGIES
卷 27, 期 2, 页码 417-425出版社
IEEE-INST ELECTRICAL ELECTRONICS ENGINEERS INC
DOI: 10.1109/TCAPT.2004.830969
关键词
automated design; design methodology; numerical methods; optimization; thermal management
The objective of this paper is to describe the development of a computationally efficient computer-aided design method, which uses a finite element numerical model coupled with empirical correlations, to create an optimum heat sink design, subject to multiple constraints. A thermal optimization challenge problem, representative of anticipated heat sink requirements in the near future, is solved to demonstrate the proposed methodology. Particular emphasis is placed upon micro-processor central processing unit chip cooling applications where, in addition to thermal requirements, the heat sink design specification includes constraints upon size, total mass, and air coolant pressure drop across the heat sink.
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