期刊
SCRIPTA MATERIALIA
卷 50, 期 12, 页码 1417-1421出版社
PERGAMON-ELSEVIER SCIENCE LTD
DOI: 10.1016/j.scriptamat.2004.03.016
关键词
Bridgman techniques; copper; corrosion; coincidence lattice; grain boundary structure
Susceptibility to intergranular corrosion of asymmetric grain boundaries in pure copper was well correlated with a geometric criteria, i.e. the effective interplanar spacing of grain boundaries rather than coincidence site lattice (CSL) scheme if we rationally assume that the grain boundary structure relaxes to be formed by low-index planes, therefore resulting in high interplanar spacing. (C) 2004 Published by Elsevier Ltd. on behalf of Acta Materialia Inc.
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