Pulsed plasmas foil sputtering applications

Pulsed plasmas for sputtering applications have increased in popularity in the past few years. Recently, a new pulsed plasma technique has been introduced to the sputtering world. High power pulsed magnetron sputtering (HPPMS) applies a very large power pulse (up to several megawatts) to the target in a short period of tune, which results in a high degree of ionisation of the sputtered species. The ionised species can be used to improve the structure and properties of the deposited film. An experimental power supply leas designed and built to learn more about HPPMS. It can produce pulses with peak powers of less than or equal to3 MW with a pulse width of 100-150 mus. The repetition rate for the pulse is from single shot to 500 Hz, and the average delivered power is less than or equal to20 kW. Evidence of the ionisation of the sputtered species is shown with time resolved optical spectroscopy of the plasma. The degree of ionisation is a junction of the power. Deposition of very thin, very high density (2(.)7 g cm(3)) carbon films by HPPMS is reported. An enabling feature of the power supply is that it can detect and suppress arcs. In addition, the pulsing power supply circuitry prevents the initiation of the arc state in normal operation. At the beginning of the pulse, it transitions directly from the glow to the highly ionised state without accessing the arc regime. (C) 2004 IoM Communications Ltd. Published by Maney for the Institute of Materials, Minerals and Mining.