期刊
APPLIED SURFACE SCIENCE
卷 290, 期 -, 页码 359-367出版社
ELSEVIER
DOI: 10.1016/j.apsusc.2013.11.084
关键词
Nano-electrical discharge machining; Molecular dynamics simulation; Two-temperature model; White layer; Residual stress
类别
资金
- National Natural Science Foundation of China (NSFC) [51175207, 51121002]
Nano-electrical discharge machining (nano-EDM) is an attractive measure to manufacture parts with nanoscale precision, however, due to the incompleteness of its theories, the development of more advanced nano-EDM technology is impeded. In this paper, a computational simulation model combining the molecular dynamics simulation model and the two-temperature model for single discharge process in nano-EDM is constructed to study the machining mechanism of nano-EDM from the thermal point of view. The melting process is analyzed. Before the heated material gets melted, thermal compressive stress higher than 3 GPa is induced. After the material gets melted, the compressive stress gets relieved. The cooling and solidifying processes are also analyzed. It is found that during the cooling process of the melted material, tensile stress higher than 3 GPa arises, which leads to the disintegration of material. The formation of the white layer is attributed to the homogeneous solidification, and additionally, the resultant residual stress is analyzed. (C) 2013 Elsevier B.V. All rights reserved.
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