4.7 Article

Effect of seed annealing temperature and growth duration on hydrothermal ZnO nanorod structures and their electrical characteristics

期刊

APPLIED SURFACE SCIENCE
卷 283, 期 -, 页码 629-635

出版社

ELSEVIER
DOI: 10.1016/j.apsusc.2013.06.159

关键词

Annealing temperature; Surface morphology; Seed layer; Electrical resistivity

资金

  1. National Nanotechnology Directorate under the Ministry of Science, Technology and Innovation Center of Excellence Program
  2. Ministry of Higher Education Malaysia
  3. Universiti Sains Malaysia

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This study investigates the effect of seed annealing temperature and growth duration on the morphology and size of zinc oxide (ZnO) nanostructures. The annealing temperature and growth duration are varied from 100 degrees C to 200 degrees C and from 3 h to 9 h, respectively. The size of the ZnO nanorods proportionally increases with growth duration, and 150 degrees C annealing temperature produces the maximum length and diameter (i.e., 4000 and 379 nm) after 9 h of growth process. However, the length and diameter significantly decreases to 3281 and 118 nm, respectively, when the annealing temperature increases to 200 degrees C. The aspect ratio for the sample annealed at 150 degrees C is the smallest at approximately 10:1, compared with 15:1 achieved during annealing at 100 degrees C and 25:1 at 200 degrees C, with similar final growth duration of 9 h. The ZnO nanorods annealed at 150 degrees C have the lowest resistivity of 6.67 x 10(3) Omega cm, but this value increases to 13.2 x 10(3) Omega cm when the annealing temperature reaches 200 degrees C after 9 h of growth. Unique ZnO nanorods are formed when bundles of ZnO nanorods grow on top of vertical ZnO nanorods when the seed layer is annealed above 150 degrees C. Based on these results, the resistivity of ZnO nanorods depends on size, growth orientation, and morphology. Uniform ZnO nanorods are successfully observed on 8 in. wafer-oxidized silicon, indicating that the process condition carried out in this experiment is reliable. (c) 2013 Elsevier B.V. All rights reserved.

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