期刊
APPLIED SURFACE SCIENCE
卷 285, 期 -, 页码 727-731出版社
ELSEVIER SCIENCE BV
DOI: 10.1016/j.apsusc.2013.08.117
关键词
Pressure sensitive adhesive; Thermal stability; Modified graphene oxide; Acrylic copolymer; UV curing
类别
资金
- Development and Performance Control of Bonding
- Debonding PSAs for MCP Semiconductor
- Ministry of Knowledge Economy and Korea Research Council for Industrial Science 82 Technology
Acrylic pressure sensitive adhesives (PSAs) with higher thermal stability for thin wafer handling were successfully prepared by forming composite with the graphene oxide (GO) nanoparticles modified to have vinyl groups via subsequent reaction with isophorone diisocyanate and 2-hydroxyethyl methacrylate. The acrylic copolymer was synthesized as a base resin for PSAs by solution radical polymerization of ethyl acrylate, 2-ethylhexyl acrylate, and acrylic acid followed by further modification with GMA to have the vinyl groups available for UV curing. The peel strength of PSA decreased with the increase of gel content which was dependent on both modified GO content and UV dose. Thermal stability of UV-cured PSA was improved noticeably with increasing the modified GO content mainly due to the strong and extensive interfacial bonding formed between the acrylic copolymer matrix and GO fillers (C) 2013 Elsevier B.V. All rights reserved.
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