期刊
APPLIED SURFACE SCIENCE
卷 256, 期 11, 页码 3554-3558出版社
ELSEVIER SCIENCE BV
DOI: 10.1016/j.apsusc.2009.12.153
关键词
Poly(ethylene terephthalate) film; Electroless copper plating; Ultrasonic assisted; Adhesion strength
类别
资金
- National Natural Science Foundation of China [60701014]
- Shanghai Leading Academic Discipline Project [B113]
Copper thin film on silane modified poly(ethylene terephthalate) (PET) substrate was fabricated by ultrasonic-assisted electroless deposition. The composition and topography of copper plating PET films were characterized by scanning electron microscopy (SEM), X-ray photoelectron spectroscopy (XPS), Xray diffraction (XRD) and atomic force microscopy (AFM), respectively. Peel adhesion strength, as high as 16.7 N/cm, was achieved for the planting copper layer to the modified PET substrate with ultrasonic-assisted deposition; however, a relative low value as 11.9 N/cm was obtained for the sample without ultrasonic vibration by the same measurement. The electrical conductivity of Cu film was changed from 7.9 x 10(4) to 2.1 x 10(5) S/cm by using ultrasonic technique. Ultrasonic operation has the significant merits of fast deposition and formation of good membranes for electroless deposition of Cu on PET film. (C) 2009 Elsevier B. V. All rights reserved.
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