期刊
IEEE TRANSACTIONS ON COMPONENTS AND PACKAGING TECHNOLOGIES
卷 27, 期 3, 页码 480-492出版社
IEEE-INST ELECTRICAL ELECTRONICS ENGINEERS INC
DOI: 10.1109/TCAPT.2004.831775
关键词
evolutionary algorithms; heat generation; multiobjective optimization; Pareto-optimal solutions; very large scale integration (VLSI) placement; wire-length
The optimal placement of electronic components on a printed circuit board is a well-studied optimization task. However, despite the involvement of multiple conflicting objectives, researchers have mainly used a single objective of minimizing the overall wire length or minimizing the overall heat generation or minimizing the overall time delay in its functioning. In this paper, the problem is treated as a two-objective optimization problem of minimizing the overall wire length and minimizing the failure-rate of the board arising due, to uneven local heat accumulation. The proposed strategy uses a novel representation procedure and a multiobjective evolutionary algorithm capable of finding multiple Pareto-optimal solutions simultaneously. Moreover, the flexibility and efficacy of the proposed strategy have been demonstrated by simultaneously optimizing the placement of components and the layout of the board. The convergence and the extent of spread obtained in the solutions reliably by repetitive applications of the proposed procedure should encourage further application of the approach to more complex placement design problems.
作者
我是这篇论文的作者
点击您的名字以认领此论文并将其添加到您的个人资料中。
推荐
暂无数据