期刊
SCRIPTA MATERIALIA
卷 51, 期 6, 页码 557-560出版社
PERGAMON-ELSEVIER SCIENCE LTD
DOI: 10.1016/j.scriptamat.2004.05.038
关键词
copper; implantation; grain boundaries; transmission electron microscopy; misorientation; helium bubbles
Copper implanted with helium at elevated temperatures has been examined by TEM. Helium bubbles with sizes larger than the size of bubbles in the interior of the grains had precipitated at some of the boundaries. The size of the bubbles in the boundaries tended to increase with increasing boundary energy. (C) 2004 Acta Materialia Inc. Published by Elsevier Ltd. All rights reserved.
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