期刊
APPLIED PHYSICS LETTERS
卷 102, 期 9, 页码 -出版社
AMER INST PHYSICS
DOI: 10.1063/1.4793419
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资金
- National Science Foundation [CMMI 1100933]
Realizing high thermal conductivity nanocomposites is a challenge because of difficulties in incorporating high fractions of uniformly dispersed nanofillers and countering low filler-matrix interfacial conductance. Here, we obviate these issues by using <3 vol. % gold nanowire fillers to obtain a 30-fold increase in polydimethylsiloxane thermal conductivity that is 6-fold higher than any nanocomposite at low nanofiller loadings and exceeds theoretical predictions. The nanowire diameter and aspect ratio are keys to obtaining cold-welded networks that enhance thermal conductivity while fostering low modulus and electrical conductivity. Such nanowire nanocomposites are attractive for many applications in electronics, packaging, and energy devices. (C) 2013 American Institute of Physics. [http://dx.doi.org/10.1063/1.4793419]
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