期刊
APPLIED PHYSICS LETTERS
卷 98, 期 19, 页码 -出版社
AMER INST PHYSICS
DOI: 10.1063/1.3590711
关键词
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资金
- MEXT [21246054]
- Grants-in-Aid for Scientific Research [21246054] Funding Source: KAKEN
We succeeded in Ohmic contact formation on an n-Ge substrate by direct sputter deposition from a TiN target and subsequent postmetallization annealing (PMA) at 350 degrees C. The Schottky barrier heights of the TiN/n-Ge and TiN/p-Ge contacts were 0.18 eV and 0.50 eV, respectively, and were maintained up to a PMA temperature of 550 degrees C. These electrical characteristics are likely to be associated with an approximately 1-nm-thick interlayer formed at a TiN/Ge interface, which leads to the alleviation of the Fermi level pinning. We demonstrated the validity of the TiN/n-Ge contact using an n(+)/p junction, which showed an excellent ideal factor of n=1.01. (C) 2011 American Institute of Physics. [doi: 10.1063/1.3590711]
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