期刊
APPLIED PHYSICS LETTERS
卷 96, 期 4, 页码 -出版社
AMER INST PHYSICS
DOI: 10.1063/1.3299259
关键词
copper; display devices; electrical resistivity; electrodes; nickel; optoelectronic devices; photovoltaic cells; sheet materials; transparency
资金
- Generalitat de Catalunya ACC1O
- Spanish National Program Plan Nacional [TEC 2007-60185]
- ICREA Funding Source: Custom
It is known that ultrathin (< 10 nm) metal films (UTMFs) can achieve high level of optical transparency at the expense of the electrical sheet resistance. In this letter, we propose a design, the incorporation of an ad hoc conductive grid, which can significantly reduce the sheet resistance of UTMF based transparent electrodes, leaving practically unchanged their transparency. The calculated highest figure-of-merit corresponds to a filling factor and a grid spacing-to-linewidth ratio of 0.025 and 39, respectively. To demonstrate the capability of the proposed method the sheet resistance of a continuous 2 nm Ni film (>950 /square) is reduced to similar to 6.5 /square when a 100 nm thick Cu grid is deposited on it. The transparency is instead maintained at values exceeding 75%. These results, which can be further improved by making thicker grids, already demonstrate the potential in applications, such as photovoltaic cells, optical detectors and displays.
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