4.6 Article

Electronic structure and contact resistance at an open-end carbon nanotube and copper interface

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APPLIED PHYSICS LETTERS
卷 96, 期 10, 页码 -

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AMER INST PHYSICS
DOI: 10.1063/1.3354077

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  1. Rockwell Collins Inc [1806F51]

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We report a quantum mechanics study on the electronic structure and contact resistance at an open-end carbon nanotube and copper interface. The local density of states near the carbon nanotube (CNT)/Cu interface are computed using density functional theory (DFT), and the transmission coefficient is calculated using a nonequilibrium Green's function method in conjunction with DFT. The current-voltage relation of the simulating cell is obtained by using the Landauer-Buttiker formula, from which the contact resistance can be determined. Our results indicate that the contact resistance of the Cu/CNT/Cu system is comparable to that of solder/Cu interface in electronic packaging. (C) 2010 American Institute of Physics. [doi: 10.1063/1.3354077]

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