期刊
SOLID STATE IONICS
卷 175, 期 1-4, 页码 541-544出版社
ELSEVIER SCIENCE BV
DOI: 10.1016/j.ssi.2004.01.081
关键词
direct patterning; soft solution process; Cu2O; thin film; electrodeposition
We have developed a direct patterning method to form Cu2O patterns onto substrates by an electrodeposition method with a glass capillary tube, including an electrolyte containing CuSO4 and chelating agent. Cu2O pattern on the titanium substrates was successfully fabricated at 60 degreesC. Furthermore, we found that the chelating agent, which has -CH(OH)COOH group, was effective to form crystalline Cu-2 patterns. (C) 2004 Elsevier B.V. All rights reserved.
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