期刊
APPLIED PHYSICS LETTERS
卷 94, 期 7, 页码 -出版社
AMER INST PHYSICS
DOI: 10.1063/1.3085957
关键词
carbon; cryogenics; desorption; fluorine; oxygen; passivation; plasma materials processing; silicon compounds; sputter etching; X-ray photoelectron spectra
The oxyfluorinated silicon passivation layer created during various cryoetching processes is of interest in order to improve high aspect ratio profiles. In this work, the desorption of a SiOxFy layer obtained in an overpassivating SF6/O-2 regime was investigated during the wafer warm-up from the cryogenic temperature to room temperature. An in situ x-ray photoelectron spectroscopy (XPS) device is used in order to probe the top-surface layer and understand the desorption mechanism. A new mechanism can be proposed using the evolution of fluorine, oxygen, silicon, and carbon contributions evidenced by XPS.
作者
我是这篇论文的作者
点击您的名字以认领此论文并将其添加到您的个人资料中。
推荐
暂无数据