4.6 Article

Effect of Sn grain orientation on electromigration degradation mechanism in high Sn-based Pb-free solders

相关参考文献

注意:仅列出部分参考文献,下载原文获取全部文献信息。
Review Physics, Applied

Physics and materials challenges for lead-free solders

KN Tu et al.

JOURNAL OF APPLIED PHYSICS (2003)