相关参考文献
注意：仅列出部分参考文献，下载原文获取全部文献信息。Short-ranged structural rearrangement and enhancement of mechanical properties of organosilicate glasses induced by ultraviolet radiation
F Iacopi et al.
JOURNAL OF APPLIED PHYSICS (2006)
Mechanical characterization of low-k and barrier dielectric thin films
N Chérault et al.
MICROELECTRONIC ENGINEERING (2005)
Challenges in the implementation of low-k dielectrics in the back-end of line
RJOM Hoofman et al.
MICROELECTRONIC ENGINEERING (2005)
Preparation of siloxane-silsesquioxane hybrid thin films for large-scale-integration interlayer dielectrics with excellent mechanical properties and low dielectric constants
JH Yim et al.
JOURNAL OF APPLIED POLYMER SCIENCE (2003)
Low dielectric constant materials for microelectronics
K Maex et al.
JOURNAL OF APPLIED PHYSICS (2003)
Measurement of the elastic and viscoelastic properties of dielectric films used in microelectronics
G Carlotti et al.
THIN SOLID FILMS (2002)
分享论文
