4.6 Article

Performance enhancement of n-channel inversion type InxGa1-xAs metal-oxide-semiconductor field effect transistor using ex situ deposited thin amorphous silicon layer

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APPLIED PHYSICS LETTERS
卷 93, 期 12, 页码 -

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AMER INST PHYSICS
DOI: 10.1063/1.2991340

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  1. Semiconductor Electronics Division of the National Institute of Standards and Technology
  2. SEMATECH
  3. FCRP Materials Structures and Devices (MSD) Center
  4. COSAR-FUSION
  5. Texas Enterprise Fund

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Significant enhancement in metal-oxide-semiconductor field effect transistor (MOSFET) transport characteristics is achieved with In(x)Ga(1-x)As (x = 0.53, x = 0.20) channel material using ex situ plasma enhanced chemical vapor deposited amorphous Si layer. In(x)Ga(1-x)As MOSFETs (L= 2 mu m, V(gs)-V(t) = 2.0 V) with Si interlayer show a maximum drain current of 290 mA/mm (x = 0.53) and 2 mu A/mm (x = 0.20), which are much higher compared to devices without a Si interlayer. However, charge pumping measurements show a lower average interface state density near the intrinsic Fermi level for devices without the silicon interlayer indicating that a reduction in the midgap interface state density is not responsible for the improved transport characteristics. (C) 2008 American Institute of Physics.

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