Surface tension driven self-assembly of bundles and networks of 200 nm diameter rods using a polymerizable adhesive

This letter demonstrates the first utilization of surface tension based self-assembly on the 200 nm scale to form mechanically stable aggregates comprised of metallic rods. The self-assembly occurs as a result of the minimization of interfacial tension of liquid layers of a hydrophobic polymerizable adhesive that is precipitated on the rods. After the assembly, the adhesive is polymerized to form permanently bonded aggregates. Depending on the patterning of the rods and the chemical functionalization used, either closed 3D bundles or open 2D networks can be formed.