Si-Ion Implantation Doping in β-Ga2O3 and Its Application to Fabrication of Low-Resistance Ohmic Contacts

We developed a donor doping technique for beta-Ga2O3 by using Si-ion (Si+) implantation. For the implanted Ga2O3 substrates with Si+ = 1 x 10(19) -5 x 10(19) cm(-3), a high activation efficiency of above 60% was obtained after annealing in a nitrogen gas atmosphere at a relatively low temperature of 900-1000 degrees C. Annealed Ti/Au electrodes fabricated on the implanted Ga2O3 layers showed ohmic behavior. The Ga2O3 with Si+ = 5 x 10(19) cm(-3) showed the lowest specific contact resistance and resistivity obtained in this work of 4.6 x 10(-6) Omega.cm(2) and 1.4m Omega.cm, respectively. (C) 2013 The Japan Society of Applied Physics