期刊
IEEE TRANSACTIONS ON SEMICONDUCTOR MANUFACTURING
卷 18, 期 1, 页码 136-139出版社
IEEE-INST ELECTRICAL ELECTRONICS ENGINEERS INC
DOI: 10.1109/TSM.2004.836656
关键词
gross die per wafer (GDW); potential good die; yield
Different forms of gross die per wafer formulas are investigated with respect to the accuracy in which they model the exact gross die per wafer count, as a function of die area and die aspect ratio. Coefficients are given with which the different formulas provide a sufficiently accurate model. To model the aspect ratio dependence, it is found that the mean of die width and die height should be used as a parameter.
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