4.8 Article

Step & flash imprint lithography

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MATERIALS TODAY
卷 8, 期 2, 页码 34-42

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ELSEVIER SCI LTD
DOI: 10.1016/S1369-7021(05)00700-5

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  1. DARPA [N66001-02-C-8011, N66001-01-1-8964]
  2. Advanced Technology Program of National Institute of Standards and Technology

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The escalating cost of next generation lithography (NGL) is driven in part by the need for complex sources and optics. The cost for a single NGL tool could soon exceed $50 million, a prohibitive amount for many companies. As a result, several research groups are looking at alternative, low-cost methods for printing sub-100 nm features. Many of these methods are limited in their ability to do precise overlay. In 1999, Willson and Sreenivasan developed step and flash imprint lithography (S-FIL (TM)). The use of a quartz template opens up the potential for optical alignment of the wafer and template. This paper reviews several key aspects of the S-FIL process, including template, tool, ultraviolet (UV)-curable monomer, and pattern transfer. Two applications are also presented: contact holes and surface acoustic wave (SAW) filters.

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