期刊
APPLIED PHYSICS A-MATERIALS SCIENCE & PROCESSING
卷 104, 期 4, 页码 1081-1084出版社
SPRINGER HEIDELBERG
DOI: 10.1007/s00339-011-6374-4
关键词
-
The absence of debris or spatters on the periphery of laser micromachining area is critical in semiconductor applications due to reduction of line width and line space of silicon (Si) devices. We studied the role of different types of volatile liquid films in reducing debris formation during femtosecond (fs) laser drilling of Si. It was found that more volatile liquids, i.e. liquids with lower boiling points and lower number of carbon atoms in the molecular formula, were more effective in reducing debris formation during the fs laser drilling process. Plasma confinement in liquid and shock waves are believed to be the main causes for the reduction of the formation of debris. The more volatile liquids also led to reduction in hole taper angles.
作者
我是这篇论文的作者
点击您的名字以认领此论文并将其添加到您的个人资料中。
推荐
暂无数据