期刊
APPLIED PHYSICS A-MATERIALS SCIENCE & PROCESSING
卷 95, 期 4, 页码 967-972出版社
SPRINGER HEIDELBERG
DOI: 10.1007/s00339-009-5125-2
关键词
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资金
- DARPA University Photonic Research (UPR) program [HR0011-04-1-0040]
- NSF
Heterogeneous integration of InGaAsP microdisk lasers on a silicon platform is demonstrated experimentally using an optofluidic assembly technique. The 200-nm-thick, 5- and 10-mu m-diameter microdisk lasers are fabricated on InP and then released from the substrates. They are reassembled on a silicon platform using lateral-field optoelectronic tweezers (LOET). The assembled laser with 5-mu m diameter exhibits a threshold pump power of 340 mu W at room temperature under pulse condition. The heterogeneously-integrated InGaAsP-on-Si microdisk laser could provide the much needed optical source for CMOS-based silicon photonics. The small footprint and low power consumption make them attractive for optical interconnect applications. The optofluidic assembly technique enables efficient use of the III-V epitaxial materials in silicon photonic integrated circuits.
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