期刊
PHYSICAL REVIEW LETTERS
卷 94, 期 6, 页码 -出版社
AMER PHYSICAL SOC
DOI: 10.1103/PhysRevLett.94.066104
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The spontaneous growth of tin whiskers on electrodeposited tin-manganese alloy coatings has been observed. This growth is distinct from any previously reported whisker growth on either pure tin or other tin-based alloy electrodeposits. It has an extremely short incubation period of a few hours only, followed by a spectacularly rapid and profuse growth. During the whole period of whisker growth, the tin-manganese electrodeposits were found to be in a tensile residual stress state. This rules out the commonly accepted explanation of a compressive stress as the driving force for tin whisker growth.
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