4.5 Article

Silicon nanophotonic devices for chip-scale optical communication applications [Invited]

期刊

APPLIED OPTICS
卷 52, 期 4, 页码 613-624

出版社

OPTICAL SOC AMER
DOI: 10.1364/AO.52.000613

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资金

  1. National Science Foundation (NSF)
  2. NSF Engineering Research Center for Integrated Access Networks (CIAN)
  3. Defense Advanced Research Projects Agency (DARPA)
  4. Army Research Office (ARO)
  5. Cymer Corporation
  6. Directorate For Engineering
  7. Div Of Electrical, Commun & Cyber Sys [1229677] Funding Source: National Science Foundation
  8. Directorate For Engineering
  9. Div Of Electrical, Commun & Cyber Sys [0901429] Funding Source: National Science Foundation

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This paper reviews recent work in the area of silicon photonic devices and circuits for monolithic and heterogeneous integration of circuits and systems on a chip. In this context, it presents fabrication results for producing low-loss silicon waveguides without etching. Resonators and add-drop distributed filters utilizing sidewall modulation fabricated in a single lithography and etching step are demonstrated. It also presents an optical pulse compressor that monolithically integrates self-phase modulation and anomalous dispersion compensation devices on a silicon chip. As an example of heterogeneous integration, we demonstrate vertical emitting metallo-dielectric nanolasers integrated onto a silicon platform. Future research directions toward large-scale photonic circuits and systems on a chip also are discussed. (C) 2013 Optical Society of America

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