期刊
MATERIALS SCIENCE AND ENGINEERING A-STRUCTURAL MATERIALS PROPERTIES MICROSTRUCTURE AND PROCESSING
卷 395, 期 1-2, 页码 265-268出版社
ELSEVIER SCIENCE SA
DOI: 10.1016/j.msea.2004.12.025
关键词
superplasticity; nanomaterials; grain boundaries; nickel; electrodeposition
The effect of sulfur (S) on superplasticity in ultrafine-grained electrodeposited nickel (Ni) was investigated by comparing the tensile behavior of Ni containing co-deposited S to electrodeposited Ni without S. Superplasticity was observed in Ni containing S in the temperature range of 350-490 degrees C, at an optimum constant strain rate of 10(-3) s(-1). Superplasticity was not achieved in Ni without S. The role of S on superplasticity was attributed to the combined effect of solute drag inhibited grain growth and the promotion of grain boundary sliding through weakened Ni-Ni bonds across S enriched grain boundaries. (c) 2005 Elsevier B.V. All rights reserved.
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