期刊
SENSORS AND ACTUATORS A-PHYSICAL
卷 119, 期 1, 页码 229-235出版社
ELSEVIER SCIENCE SA
DOI: 10.1016/j.sna.2003.10.063
关键词
tensile test; single crystal silicon; film; mechanical property; fracture toughness
We developed a method of measuring the fracture toughness, which is a material constant in the macroscopic domain, of micro-machined sinale crystal silicon film on the (100) plane. We notched the thin film specimen on a single edge and then conducted a uniaxial tensile test to specimen failure. The average value of measured fracture toughness was 1.58 MPa m (1/2), with scatter. This is slightly higher than, but comparable to, the value for bulk silicon. Scanning electron microscope (SEM) observation of the failed specimens revealed that the fracture developed mainly along the (110) cleavage plane. (c) 2003 Elsevier B.V. All rights reserved.
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