期刊
INTERNATIONAL JOURNAL OF SOLIDS AND STRUCTURES
卷 42, 期 9-10, 页码 2533-2558出版社
PERGAMON-ELSEVIER SCIENCE LTD
DOI: 10.1016/j.ijsolstr.2004.10.008
关键词
viscoplasticity; phase field model; tin-lead solder; microstructure dependence
类别
A phase field model is presented to describe the mechanical behaviour of microstructure dependent materials, which is demonstrated by applying it to eutectic tin-lead solder. This solder material is known to be heavily influenced by its continuously evolving microstructure. For the constitutive behaviour of the different phases the elasto-viscoplastic Perzyna model has been used. It is coupled to the phase field model through the constitutive parameters which are taken dependent on the mass fraction field resulting from the solution of the phase field equations. (C) 2004 Elsevier Ltd. All rights reserved.
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