Micro metal powder injection molding of W-Cu nanocomposite powder

Increasing attention is being paid to micro metal injection molding as a manufacturing technology for miniature parts. W-Cu nanocomposites have been used as heat sink and packaging materials in microelectronic devices. A micro injection molding technique will provide an appropriate tool to fabricate W-Cu nanocomposite materials for microcomponents. In the present study, a fundamental investigation of micro metal injection molding using W-Cu nanocomposite powder is reported. The densification behavior of W-Cu nanocomposite was examined in order to confirm the shape stability of microcomponents.