期刊
JOURNAL OF THERMAL ANALYSIS AND CALORIMETRY
卷 81, 期 2, 页码 369-373出版社
SPRINGER
DOI: 10.1007/s10973-005-0794-3
关键词
cure kinetics; DSC; epoxy resin; poly(oxypropylene) diamine
A kinetic study of cure kinetics of epoxy resin based on a diglycidyl ether of Bisphenol A (DGEBA), with poly(oxypropylene) diamine (Jeffamine D230) as a curing agent, was performed by means of differential scanning calorimetry (DSC). Isothermal and dynamic DSC characterizations of stoichiometric and sub-stoichiometric mixtures were performed. The kinetics of cure was described successfully by empirical models in wide temperature range. System with sub-stoichiometric content of amine showed evidence of two separate reactions, second of which was presumed to be etherification reaction. Catalytic influence of hydroxyl groups formed by epoxy-amine addition was determined.
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