Interface material mixing formed by the deposition of copper on aluminum by means of the cold spray process

The objective of this article is to present microstructural evidence of a bonding mechanism between copper, which has been deposited by the cold spray process, and an aluminum substrate. Deposition conditions are varied to determine their effects on the nature of the bond. Mechanical measurements, such as adhesion strength and hardness, as well as visual methods are used to characterize the process. A ballistic model is proposed to explain the process.