期刊
JOURNAL OF THERMAL SPRAY TECHNOLOGY
卷 14, 期 3, 页码 330-334出版社
SPRINGER
DOI: 10.1361/105996305X59332
关键词
bond strength; coatings; cold spray
The objective of this article is to present microstructural evidence of a bonding mechanism between copper, which has been deposited by the cold spray process, and an aluminum substrate. Deposition conditions are varied to determine their effects on the nature of the bond. Mechanical measurements, such as adhesion strength and hardness, as well as visual methods are used to characterize the process. A ballistic model is proposed to explain the process.
作者
我是这篇论文的作者
点击您的名字以认领此论文并将其添加到您的个人资料中。
推荐
暂无数据